PM660, PM8150, PM7150, and More – Multi-Format Power Management Reballing Mesh

AMAOE PM3 Power IC Reballing Stencil is a premium-grade mesh tool made for precision reballing of a wide variety of Qualcomm PMIC (Power Management IC) chips used in flagship and mid-range Android smartphones. With 0.12mm ultra-thin stainless steel and 20+ precise cutouts—including formats like PM660A/L, PM670, PM7150, PM8150B, PM540, PM439, PM845, PM632, PM640—the PM3 stencil supports reballing tasks across multiple chipset generations.

Whether you're repairing power faults, charging issues, or replacing damaged BGA power ICs, this stencil ensures tight solder ball placement and smooth rework processes, especially under microscope-based hot air soldering. Compatible with devices from Samsung, Xiaomi, Oppo, Vivo, OnePlus, Huawei, Honor, and more.