Advanced Stencil Mesh for Qualcomm Power Management ICs – PM660, PM8998, PM8952 & More.

AMAOE PM2 Power IC Reballing Stencil is a high-precision mesh stencil designed for reballing and repairing Qualcomm PMIC (Power Management Integrated Circuit) chipsets. Built from 0.12mm ultra-fine stainless steel, this stencil is part of the AMAOE professional-grade series tailored for logic board-level repairs on Android smartphones.

The PM2 stencil covers over 20 critical Qualcomm power ICs, including popular chipsets like PM660, PM8937, PM8940, PM8998, PM8952, PM820EAD, and others found in mid- to high-end devices from Samsung, Xiaomi, Oppo, Vivo, Huawei, OnePlus, Motorola, and more.

Its precise cutouts and heat-resistant structure make it ideal for use with hot air rework stations under a microscope—ensuring perfect solder ball placement and clean BGA finishes.