The AMAOE MU4 stencil is designed for chip-level rework on MediaTek Dimensity and Helio G-series CPUs, including some of the most recent and high-performance chipsets such as MT6885Z (Dimensity 1000), MT6853V (Dimensity 720), MT6769V (Helio G70), MT6779V (Helio P90), MT6758V (Helio P30), MT6768V (Helio G70), and MT6891Z (Dimensity 1100). It also supports the RAM ICs corresponding to these processors. Built from 0.12mm superhard stainless steel, the stencil features half-etched structure, precision-cut holes, and exceptional thermal resistance—ensuring repeatable, high-accuracy reballing on modern MTK SoCs. This stencil is ideal for use on smartphones from Xiaomi, Realme, Vivo, Oppo, Infinix, Tecno, Motorola, Nokia, Lava, Itel, Micromax, ZTE, Honor, and POCO, making it an essential tool for repair technicians and training labs across Nepal.