AMAOE MU3 BGA stencil is designed for professional-level reballing of MediaTek MTK CPUs, specifically chipsets such as MT6762V (Helio A22), MT6763V (Helio P23), MT6757V (Helio P20), MT6771V (Helio P60), and MT6739V. Crafted from durable 0.12mm stainless steel, it features laser-cut precision mesh and a half-etched platform for stable heat resistance and perfect alignment. MU3 is widely used in rework labs and mobile repair centers that service budget to mid-range phones from brands like Xiaomi, Realme, Vivo, Oppo, Tecno, Itel, Nokia, Infinix, Micromax, Lava, BLU, QMobile, Gionee, Karbonn, and others. With universal compatibility across shared IC layers, this stencil simplifies MediaTek CPU reballing without needing multiple templates. Whether you're repairing a Redmi 6A, Oppo A83, Realme 1, Vivo Y95, Infinix Note 5, or Lava Z-series phone, the MU3 stencil delivers consistent, accurate results. Perfect for chip-level technicians across Nepal, the MU3 helps ensure efficient IC repairs in smartphones using Helio A and P series chipsets. Get it now from GSMBAZAR, Nepal’s trusted supplier of mobile repair tools.