Supports Snapdragon Gen1/Gen2/Gen3, Dimensity 9200/1050, MT6781V, MT6879V & Universal BGA496 RAM

High-Precision Hybrid IC Mesh

AMAOE MQ6 stencil is a high-precision hybrid reballing mesh crafted for advanced chip-level technicians working on the latest Qualcomm Snapdragon and MediaTek Dimensity processors. Whether you're repairing flagship or upper-midrange 5G smartphones, this 0.12mm half-etched stencil ensures clean solder ball alignment, long-term durability, and anti-warp performance under hot air or IR reflow. This model supports chipsets such as Snapdragon 6 Gen1 (SM6450), Snapdragon 8 Gen3 (SM8650), Snapdragon 4 Gen2 (SM4450) along with MediaTek Dimensity 9200 (MT6985W), Dimensity 1050 (MT6879V), Helio G96 (MT6781V), and MT8781V. It also includes a universal BGA496 RAM stencil compatible with LPDDR4X/LPDDR5 configurations.

Whether you're reballing a Xiaomi 14, OnePlus 12, iQOO Neo9, Realme Narzo 60 Pro, or Vivo X90s, MQ6 gives you wide chipset coverage with ultra-fine mesh accuracy.