Supports Snapdragon 8 Gen1, 888, 8450, 778G, Dimensity 900, 810, MT6799W & RAM ICs 

Professional-Grade Hybrid IC Mesh

AMAOE MQ4 stencil is a premium dual-platform reballing template supporting both Qualcomm Snapdragon and MediaTek Dimensity chipsets. Engineered for chip-level mobile repair technicians, this stencil offers clean, consistent solder reflow for flagship and upper-midrange CPUs along with matching RAM layouts. With compatibility across chipsets like Snapdragon 8 Gen1 (SM8450), Snapdragon 888 (SM8350), Snapdragon 778G (SM7325/SM7315), and MediaTek Dimensity 900 (MT6877V), Dimensity 810 (MT6833V), MT6799W, the MQ4 is ideal for servicing modern 5G smartphones. It also includes dedicated RAM stencils for SM8350/SM8450 and MT6799W.

Built from 0.12mm superhard stainless steel, MQ4 features half-etched mesh to prevent lift and warping during reballing. Whether you’re working on a Realme GT Neo 3T, Redmi K50i, Galaxy A73, or Infinix Zero 5G, this stencil is built to deliver precision and repeatability.