Supports SM8250, MT6885Z, Snapdragon 865, SM7150, SM7250, SM6125 & RAM ICs

-Precision Mesh for Pro-Level Rework

AMAOE MQ3 stencil is an advanced BGA reballing mesh designed to support both Qualcomm Snapdragon and MediaTek Dimensity CPUs, specifically those found in mid to flagship smartphones. Built with ultra-precise 0.12mm superhard stainless steel, MQ3 offers stability, durability, and clean solder alignment for technicians doing chip-level IC repair.

MQ3 supports CPUs such as Snapdragon 865 (SM8250), SM7250 (Snapdragon 765G), SM7150 (Snapdragon 730), SM6125 (Snapdragon 665) as well as MediaTek MT6885Z (Dimensity 1000). The stencil also includes slots for SM8250 RAM and MT6885Z RAM, making it ideal for dual-function CPU + RAM reballing.

Perfect for phones from Xiaomi, Realme, Oppo, Vivo, iQOO, Samsung, LG, Honor, Infinix, and others. MQ3 is the ultimate hybrid stencil for modern multi-brand chip-level service providers in Nepal.