Supports MSM8939V, SDM439, MT6754V, MT6758V, MT6761V, MT6765V, MT6768V

-Hybrid CPU Stencil for Precise Chip-Level Repair

MAOE MQ2 stencil is a hybrid professional BGA reballing mesh, crafted for technicians who work on both Qualcomm Snapdragon and MediaTek MTK chipsets. Built from durable 0.12mm thick superhard stainless steel, this stencil ensures consistent, high-precision solder ball placement while withstanding repeated thermal cycles. MQ2 supports widely-used chipsets such as MSM8939V (Snapdragon 615), SDM439, MT6765V (Helio P35), MT6761V (Helio A22), MT6758V (Helio P30), MT6754V (Helio X10) and also includes a slot for MSM8939W RAM, making it ideal for CPU + RAM IC reballing.

Designed with a half-etched structure to prevent mesh lift and improve stability during hot air or IR rework, this stencil is perfect for repairing phones from Xiaomi, Vivo, Oppo, Realme, Tecno, Infinix, Nokia, Lenovo, LG, Gionee, and more.