Professional CPU IC Repair Stencil: MQ1

The AMAOE MQ1 stencil is a hybrid CPU reballing template engineered for both Qualcomm Snapdragon and MediaTek (MTK) chipsets. Built from high-grade 0.12mm superhard stainless steel, this stencil ensures precise solder ball alignment and thermal resistance, making it ideal for professional chip-level mobile repair.

MQ1 supports multiple Qualcomm and MTK SoCs including:

• Qualcomm Snapdragon: SDM660, SDM710, SDM845
• MediaTek: MT6765V, MT6771V, MT6757V, MT6799V

With half-etched mesh design (as shown in the SDM845 close-up), this stencil prevents stencil lift and ensures accurate, clean ball placement—especially important for tight-pitch ICs. Whether you're repairing premium Qualcomm-based devices or mid-range MTK-powered smartphones, AMAOE MQ1 provides the flexibility and precision technicians need.