Superhard 0.12mm Universal BGA Stencil Set for Qualcomm & MediaTek Chipsets – OV7, OV8, OV9

-for OPPO, Vivo, Xiaomi, Realme, iQOO

AMAOE OV Series Stencils (OV:7 to OV:9) are professional-grade superhard 0.12mm laser-etched BGA reballing stencils, designed for repairing a wide range of Qualcomm Snapdragon and MediaTek Dimensity / Helio CPUs, RAM, and power ICs. Engineered with advanced alignment precision and durability, these stencils are ideal for mobile phone motherboard rework and IC soldering in smartphones from Vivo, OPPO, Xiaomi, Huawei, Realme, and iQOO.

Each stencil in the OV series supports a unique set of popular chipsets and models, making it a versatile choice for technicians performing multi-brand logic board repair.