Supports SC6531DA, SC9820A, SC9850, SC6820 & More | Precision BGA Stencil for Budget Mobile Chipsets

AMAOE SU2 BGA Reballing Stencil is designed for precise reballing of Spreadtrum/UNISOC SC Series chipsets, widely used in entry-level smartphones, feature phones, and IoT devices. Crafted with superhard stainless steel (0.12mm) and laser-etched mesh holes, this stencil provides accurate solder alignment for fine-pitch CPU and baseband IC rework. This stencil covers a wide range of popular SC chipsets such as SC6531DA, SC9850, SC9820A, SC6820, SC6533G, and others—used in devices from brands like Itel, Lava, Tecno, Micromax, Intex, Gionee, and Symphony.

Whether you're replacing a baseband IC on a keypad phone or reworking a budget 4G smartphone board, the SU2 stencil delivers high accuracy, minimal residue, and reusability under heat.