Samsung CPU Chipset BGA Stencils SAM Series
AMAOE SAM Series – Samsung CPU Reballing Stencils (SAM1 to SAM20)
Welcome to the AMAOE SAM Series, a professional-grade collection of reballing stencils for Samsung devices, specifically crafted for CPU, RAM, and EMCP chipsets used in Samsung Galaxy smartphones and tablets. Spanning models SAM1 to SAM18, this series provides extensive chipset compatibility, from Exynos 7420, 7885, 9610, 990, 2100, 2200 to Snapdragon SDM845, SM8150, SM8350, SM8450, and newer E8825 and E8835P processors.
Whether you're repairing Galaxy J-series, A-series, S-series, Note-series, or Fold/Flip devices, this stencil series is your one-stop solution for precise CPU reballing, EMCP soldering, and middle-layer IC work.
Each stencil is made from ultra-durable stainless steel, with 0.12MM and 0.10MM mesh thickness depending on model, and features high-precision laser-cut apertures, semi-engraved shielding designs, and anti-warping build—ideal for technicians and rework labs demanding accurate, clean, and repeatable solder ball placement.
What’s Included Across SAM1–SAM20?
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Support for 100+ Samsung CPU/PMIC/RAM chipsets
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Exynos & Snapdragon compatibility (7420 to 2200, SDM845 to SM8450)
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Models for Galaxy A10–A90, S6–S22 Ultra, Note 5–Note 20, Fold, Flip & more
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Specialized ICs: PM8953, W9020, SPU15/Q, SM5714, SDR865, QDM3525, etc.
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Fine-pitch 0.12MM / 0.10MM mesh options for modern soldering standards
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High-temp-resistant mesh with tight aperture tolerances
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Designed for Samsung board structure—perfect alignment for BGA work
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