REBALLING STENCIL FOR UNISOC UN Series
AMAOE UN Series is a professional-grade collection of BGA reballing stencils specifically designed for UNISOC chipsets and a wide range of universal ICs found in mobile phones, feature phones, and smart devices. Built under AMAOE’s renowned Superhard Series, these stencils are laser-cut from ultra-thin 0.12mm stainless steel, ensuring unmatched precision, durability, and heat resistance during IC rework or tin planting.
Whether you're repairing UNISOC UMS9230H, UMS9620S, UMS512T, or dealing with various power ICs, PMICs, and combo chips, the UN series provides the ideal stencil layout for clean, consistent soldering. Models like UN1, UN2, and UN3 support multiple IC sizes including BGA153, BGA198, BGA254, and help cover popular chipsets like RR88643, SR3595D, SC89601S, and more.
This series is especially useful for technicians working on itel, Lava, Tecno, Infinix, realme and other devices using UNISOC platforms. Perfect for professional mobile repair labs and IC-level technicians in Nepal and beyond, the AMAOE UN Series ensures accuracy, speed, and long-term performance in every rework session.
