Qualcomm and MTK CPU Chipset Stencils – MQ Series (MQ1 to MQ6)
Professional BGA Reballing Meshes for Mobile Phone IC Repair | AMAOE MQ-Series
MAOE MQ Series is a professional collection of hybrid BGA reballing stencils engineered to support both Qualcomm Snapdragon and MediaTek Dimensity/Helio CPU and RAM ICs. Designed for advanced mobile phone repair technicians and reballing professionals in Nepal and beyond, each stencil in the MQ series is made from 0.12mm superhard stainless steel, ensuring high durability, precision, and thermal stability during high-heat rework processes.
