Qualcomm PMIC Reballing Stencils PM
The AMAOE PM Series (PM1 to PM3) features professional-grade reballing stencils specifically engineered for Qualcomm PMIC (Power Management Integrated Circuit) chipsets. These chipsets play a crucial role in battery charging, voltage regulation, and power distribution in smartphones. Designed for chip-level repair, each stencil in the series supports a wide range of Qualcomm power ICs such as PM8916, PM8998, PM660, PM7150, PM8150, and many more.
Ideal for use with hot air rework stations under microscopes, these 0.12mm stainless steel stencils ensure precise solder ball alignment, minimal bridging, and exceptional heat resistance. The PM1–PM3 range covers ICs used in devices from Samsung, Xiaomi, Vivo, Oppo, Realme, OnePlus, Huawei, Honor, Nokia, and other leading mobile brands.
Included Series:
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PM1 – Covers foundational chipsets like PM8916, PM8996, PM8953, PM8058, PM8841
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PM2 – Features mid-range and advanced ICs including PM8998, PM8952, PM820EAD, PM8084
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PM3 – Includes newer-gen ICs like PM7150, PM8150, PM660A/L, PM540, PM845/562
