Qualcomm CPU Chipset Series Stencil QU Series
Qualcomm CPU Chipset Series Stencil QU is a complete collection of professional BGA reballing stencils designed specifically for Qualcomm Snapdragon CPU rework. Covering QU:1 to QU:9, this series includes support for a wide range of Qualcomm chipsets including the Snapdragon 200, 400, 600, and 800 series – such as MSM8916, MSM8937, MSM8953, MSM8996, MSM8998, SDM660, and many more.
Each stencil is manufactured with 0.12mm superhard stainless steel, featuring high-precision laser-cut holes, anti-warp thermal vent design, and clear chipset markings – ensuring accurate solder ball alignment for technicians during chip-level repair.
These stencils are compatible with devices from almost all major smartphone brands, including:
Xiaomi, Samsung, Vivo, Oppo, Realme, Nokia, Motorola, Huawei, LG, HTC, Lenovo, OnePlus, Sony, ZTE, Micromax, Lava, and others.
Whether you’re working on flagship models like Galaxy S8, OnePlus 5, Mi A2, or entry-level phones like Redmi 4, Nokia 3.1, Galaxy J2, the QU Series offers you precise solutions for reliable BGA rework.
Available exclusively at GSMBAZAR – Nepal’s trusted source for chip-level mobile repair tools and accessories.
