The AMAOE MU Series is a specialized range of BGA reballing stencils built exclusively for MediaTek (MTK) CPU chipsets, widely used in Android smartphones and tablets. Manufactured from 0.12mm superhard stainless steel, each stencil in the MU series is engineered for accurate solder ball alignment, long-term heat resistance, and flawless IC rework.
From entry-level processors like Helio A22 (MT6761) and P35 (MT6765) to more advanced chipsets like Helio G96 (MT6781) and Dimensity 700 (MT6833), the MU series supports dozens of MediaTek platforms found in phones from Xiaomi, Realme, Vivo, Infinix, Tecno, Nokia, Lava, Itel, Lenovo, Micromax, and more. Each stencil features a half-etched, anti-warp design to maintain perfect contact during reballing. Whether you're reworking CPU, RAM, or eMMC ICs, the MU series provides clean, consistent performance, making it the go-to stencil set for technicians across Nepal and beyond.
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Supports a wide range of MediaTek Helio and Dimensity chipsets
Ideal for reballing CPU, RAM, and eMMC ICs
Made from 0.12mm superhard stainless steel
Precision laser-cut mesh layout
Reusable with high heat resistance
Compatible with phones from Xiaomi, Realme, Infinix, Vivo, Tecno, Nokia, Itel, Lava, Micromax, etc.
Used by chip-level repair labs and training institutes
