Explore the complete range of AMAOE Samsung S Series Middle Layer BGA Reballing Platforms, designed specifically for chip-level repairs on Galaxy S21, S22, S23, and S24 logic boards. These soldering platforms are engineered for reverse-side (back layer) and middle-layer CPU, RAM, and PMIC reballing, ensuring perfect solder ball alignment and minimal splash during rework.
Each platform set features a 0.12mm ultra-precise etched stainless steel stencil, a custom-fit positioning plate, and a strong magnetic base fixture for steady and accurate IC reballing. Compatible with global and regional variants including SM-G991U, G996U, G998U, S901U, S906U, S908U, S916U, S918U, and S928U, these tools offer unmatched thermal resistance and reusability for modern multilayer PCB structures.
S21 / S21+ / S21 Ultra – G991U, G996U, G998U
S22 / S22+ / S22 Ultra – S901U, S906U, S908U
S23 / S23+ / S23 Ultra – S911U, S916U, S918U
S24 / S24+ / S24 Ultra – S921U, S926U, S928U
Ideal For:
Middle-layer and reverse-layer BGA reballing
CPU, RAM, PMIC, and SoC IC rework
Samsung Galaxy S21 to S24 Ultra (Global/US/Canada/Asia variants)
Stencil Only (0.12mm for SM-S918U/O/W/D): NRs 350
Stencil + Positioning Plate: NRs 1600
Full Reballing Kit (Stencil + Plate + Magnetic Base Fixture): NRs 3000
