AMAOE U-SMU Series is a professional collection of BGA reballing platforms and stencils specially engineered for Samsung Exynos CPU and RAM IC chipsets. Built under AMAOE’s UBGA precision series, each stencil features a 0.12mm ultra-fine mesh, laser-etched for consistent solder ball alignment, reduced splash, and high heat resistance—perfect for chip-level repairs on Samsung logic boards.
From mid-range processors like Exynos 7885, 9609, 9611, to flagship chipsets like Exynos 2100, 2200, 9820, 9810, and 990, this series supports both CPU and RAM IC tin planting—making it a one-stop solution for repair technicians handling devices across Samsung’s A, M, and S-series.
Each U-SMU stencil is compatible with the UBGA-A magnetic fixture base, and can be paired with an optional positioning plate for added stability and precision. Whether you're working on Galaxy S21, S22, Note 20, A52, A33, M30, or J-series, the U-SMU Series is built to deliver clean, reliable reballing for long-term repairs.
Ideal for mobile repair professionals, chip rework labs, and logic board specialists working on Samsung Exynos-powered smartphones and tablets.
