BUY RL-406 HIGH TEMPERATURE LEAD-FREE TIN PASTE NOW

                   RL-406 is a high temperature lead-free solder paste that is specially designed for the repair of high-end machine motherboards. With a melting point of 227℃, this tin paste is capable of effectively protecting circuit board components while performing maintenance.

                  The tin paste features tin lighting, strong tin climbing, and high purity, making it easy to store and use. It has a delicate stickiness and is composed of pure ingredients, allowing it to create a fine paste that does not bubble or create silver bright spots.

                 This solder paste is suitable for a wide range of electronic components, including BGA chips, SMT maintenance, and high-end machine motherboards. It has good wettability and strong viscosity, which are important characteristics for successful soldering.

                One of the main advantages of RL-406 is its accurate temperature control, which ensures that the circuit board components are effectively protected during maintenance. It is also lead-free and environmentally friendly, making it a preferred raw material.

               RL-406 is particularly well-suited for use on IP12/12 Pro/12 Pro Max motherboards, where it can be used for middle layer tin planting. The high temperature middle layer tin paste features a silver-containing formula that produces good silver highlights.